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Cu/Mo/Cu復(fù)合板界面變形及厚度配比
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陜西省教育廳產(chǎn)業(yè)化項目(2011GJ11)；陜西省“13115”科技創(chuàng)新工程重大科技專項項目(2008ZDKG-41)


Interface Deformation and Rolling Thickness-Ratio of Cu/Mo/Cu Composite Plates
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    摘要:

    采用熱軋+溫軋方法制備Cu/Mo/Cu復(fù)合板，研究軋制工藝對復(fù)合板結(jié)合界面及組元厚度配比的影響。結(jié)果表明：經(jīng)過軋制變形后，銅鉬界面實現(xiàn)緊密結(jié)合且結(jié)合機制為齒狀嚙合，銅層外表面和靠近界面層的晶粒比中部細??；隨著變形量的增加，銅層等軸狀晶粒沿軋制方向被拉伸，界面結(jié)合效果明顯改善，且由齒狀變得較為平直。分析組元厚度配比，銅層變形量較鉬層的大，隨著總壓下量的增加，組元壓下率的差值減小，變形量逐漸趨于一致；首次提出了Cu/Mo/Cu三層復(fù)合板厚度配比的關(guān)系，為實際選擇原料提供依據(jù)

    Abstract:

    Effects of rolling process on bonding interface and the element thickness-ratio of Cu/Mo/Cu cladding plates prepared by hot rolling and warm rolling were studied. The results show that the Cu/Mo interface is closely bonded after rolling deformation and the bonding mechanism of Cu/Mo is dentate meshing. The grain of Cu layer near the surface and the interface is smaller than that in the center. With the increase of the deformation, the equiaxed grains of Cu layer are stretched along the rolling direction. The bonded effect of the interface is significantly improved and becomes straighter from the dentition. The deformation of Cu layer is larger than that of Mo layer. The thickness-ratio was analyzed. With the increase of the total reduction, the difference of the element deformation decreases and the element deformation gradually tends to conform. The thickness-ratio of Cu/Mo/Cu composites relation is proposed and it offers a method for base material choice

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王快社,王 峰,張 兵,林兆霞,孔 亮,郭 韡. Cu/Mo/Cu復(fù)合板界面變形及厚度配比[J].稀有金屬材料與工程,2013,42(11):2389~2393.[Wang Kuaishe, Wang Feng, Zhang Bing, Lin Zhaoxia, Kong Liang, Guo Wei. Interface Deformation and Rolling Thickness-Ratio of Cu/Mo/Cu Composite Plates[J]. Rare Metal Materials and Engineering,2013,42(11):2389~2393.]
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  • 收稿日期:2012-11-06
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