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板級焊點結(jié)構(gòu)的熱疲勞及機械疲勞性能分析
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北京市自然科學(xué)基金(3102002); 國家自然科學(xué)基金(51005004); 北京市委組織部優(yōu)秀人才培養(yǎng)計劃項目; 現(xiàn)代焊接生產(chǎn)技術(shù)國家重點實驗室開放課題研究基金


Thermal Fatigue and Mechanical Fatigue Behavior of Board Level Solder Joint
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    摘要:

    采用實驗測試與數(shù)值模擬相結(jié)合的方法對錫鉛釬料和無鉛釬料SAC305板級焊點分別在熱疲勞和機械疲勞載荷作用下的破壞規(guī)律進行比較研究。結(jié)果表明：相對于傳統(tǒng)錫鉛釬料而言，常用無鉛釬料(SAC305)焊點結(jié)構(gòu)具有較為優(yōu)異的抗熱疲勞性能，然而其抗機械疲勞性能相對較差。由此，采用有限元方法分析了兩種釬料焊點結(jié)構(gòu)在熱疲勞和機械疲勞過程中的塑性應(yīng)變和蠕變應(yīng)變演變過程，以探討表面貼裝板級焊點結(jié)構(gòu)熱疲勞和機械疲勞破壞過程的本質(zhì)區(qū)別

    Abstract:

    The thermal fatigue behavior and mechanical fatigue behavior of board level solder joint were investigated by experimental testing and numerical simulation. And two kinds of solder materials, including traditional eutectic lead-tin solder and SAC305 lead-free solder, were considered. Results show that the lead-free solder (SAC305) joint has a longer thermal fatigue lifetime, but a shorter mechanical fatigue lifetime than the eutectic solder joint. Therefore, the evolutions of inelastic strains, including creep and plastic strain, caused by thermal fatigue and mechanical fatigue loading in the solder joint were analyzed by a finite element method. And the difference of solder joint’s thermal fatigue and mechanical fatigue behavior was presented

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林 健,雷永平,吳中偉,楊 碩.板級焊點結(jié)構(gòu)的熱疲勞及機械疲勞性能分析[J].稀有金屬材料與工程,2013,42(9):1874~1878.[Lin Jian, Lei Yongping, Wu Zhongwei, Yang Shuo. Thermal Fatigue and Mechanical Fatigue Behavior of Board Level Solder Joint[J]. Rare Metal Materials and Engineering,2013,42(9):1874~1878.]
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  • 收稿日期:2012-09-23
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