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Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple
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Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple
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Postgraduate Innovation Programs of Jiangsu Scientific Research(CXLX11_0921); The Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)

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    摘要:

    研究了工藝參數(shù)對(duì)Ta/Cu真空擴(kuò)散焊的影響。利用掃描電鏡（SEM）、能譜分析（EDS）、顯微硬度等測(cè)試方法對(duì)結(jié)合面微區(qū)進(jìn)行了分析。結(jié)果表明：采用真空擴(kuò)散焊工藝，在焊接壓力為10 MPa及焊接時(shí)間為60 min的工藝參數(shù)下，界面孔洞隨著焊接溫度的升高而減少，在焊接溫度達(dá)到1000 °C時(shí)，結(jié)合面內(nèi)孔洞基本消失，結(jié)合面擴(kuò)散區(qū)域?qū)挾葹?~5 μm；加工硬化導(dǎo)致硬度升高，焊合區(qū)的硬度值要比未焊合區(qū)的硬度值稍高

    Abstract:

    The effects of process parameters on vacuum diffusion bonding between tantalum (Ta) and copper (Cu) were studied. The interfacial structure of Ta/Cu joint was analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and microhardness test. The results indicate that under the condition of loading pressure of 10 MPa and holding time of 60 min, the number of interfacial voids decreases with increasing of bonding temperature. With the temperature up to 1000 °C, the voids at the interface disappear completely, the joint has the maximum shear strength, and its interfacial layer is about 3 to 5 μm. The microhardness test shows that the hardness in weld zone is relatively higher than that in non-weld zone due to the fact that work hardening takes place in the matrix and the joint interface

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周方明,張富強(qiáng),宋飛遠(yuǎn),李桂鵬,同 雷. Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple[J].稀有金屬材料與工程,2013,42(9):1785~1789.[Zhou Fangming, Zhang Fuqiang, Song Feiyuan, Li Guipeng, Tong Lei. Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple[J]. Rare Metal Materials and Engineering,2013,42(9):1785~1789.]
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  • 收稿日期:2012-09-25
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