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熔煉工藝和增強(qiáng)相含量對Sn基復(fù)合釬料顯微組織的影響
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國家自然科學(xué)基金面上項(xiàng)目（51071006）; 北京市自然科學(xué)基金面上項(xiàng)目（2122004）


Effects of Metallurgy Processing and Reinforcement Particle Amount on Microstructure of Sn-Based Composite Solder
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    摘要:

    分別研究了不同冷卻速率和增強(qiáng)相添加量對內(nèi)生法制備的Cu6Sn5顆粒增強(qiáng)型復(fù)合釬料以及Ni顆粒增強(qiáng)復(fù)合釬料顯微組織的影響，并得出最佳的冷卻工藝條件。結(jié)果表明：空冷條件（冷卻速率為2 ℃/s）下制備的Cu6Sn5顆粒增強(qiáng)型復(fù)合釬料擁有最佳的顯微組織形貌特征，其金屬間化合物(IMC)尺寸最小，分布最均勻。對于外加法制備的Ni顆粒增強(qiáng)型復(fù)合釬料，其內(nèi)部大尺寸IMC對周邊三元共晶組織生長方向產(chǎn)生嚴(yán)重影響。此外，值得注意的是，當(dāng)Ni質(zhì)量分?jǐn)?shù)為0.45%時，顯微組織中出現(xiàn)了由IMC聚集形成的樹葉和雪花形態(tài)。當(dāng)Ni質(zhì)量分?jǐn)?shù)增加至2.0%時，由于Ni元素在釬料基體中固溶的作用，顯微組織中出現(xiàn)了均勻分布的形狀和大小不一的黑色斑點(diǎn)

    Abstract:

    The effects of different cooling rates and reinforcement particle amount on in-situ Cu6Sn5 reinforced composite solder and Ni reinforced composite solder were investigated. The results indicate that the optimal microstructure characterizations, which hold the smallest intermetallic compound (IMC) size and uniform distribution in the solder matrix, of in-situ Cu6Sn5 reinforced composite solder can be achieved under air cooling condition (the cooling rate is 2 oC/s). From the microstructure observation of Ni reinforced composite solder, it is found that big sized IMCs have a significant effect on the growth orientation of ternary eutectic phases. Besides, snow- and leaves-shaped IMCs clusters are found in Sn3.0Ag0.5Cu-0.45Ni solder matrix. When Ni addition increases to 2.0 wt%, dark spots with different sizes and shapes appear uniformly in the solder matrix due to the solid solution effect of Ni in the solder

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馬立民,韓孟婷,邰 楓,郭 福.熔煉工藝和增強(qiáng)相含量對Sn基復(fù)合釬料顯微組織的影響[J].稀有金屬材料與工程,2013,42(7):1502~1506.[Ma Limin, Han Mengting, Tai Feng, Guo Fu. Effects of Metallurgy Processing and Reinforcement Particle Amount on Microstructure of Sn-Based Composite Solder[J]. Rare Metal Materials and Engineering,2013,42(7):1502~1506.]
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  • 收稿日期:2012-07-16
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