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AuSn釬料及AuSn/Ni焊點的組織性能研究
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Microstructure and Properties of AuSn Solder and AuSn/Ni Joint
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    摘要:

    分別采用疊軋-合金化法和回流焊技術制備AuSn箔材釬料和AuSn/Ni焊點，用掃描電子顯微鏡及電子萬能試驗機研究釬焊時間對AuSn/Ni界面組織及焊點剪切性能的影響。結果表明：采用疊軋-合金化法制備的AuSn釬料的熔點和化學成分都接近Au-20Sn共晶釬料。Ni/AuSn/Ni焊點在330 ℃釬焊30 s時形成良好的層狀ζ-(Au,Ni)5Sn+δ-(Au,Ni)Sn共晶組織；釬焊60 s時，AuSn/Ni界面產生薄而平直的 (Ni,Au)3Sn2金屬間化合物 (IMC) 層和針狀 (Ni,Au)3Sn2化合物；隨著釬焊時間繼續(xù)延長，(Ni,Au)3Sn2 IMC層厚度明顯增加，針狀 (Ni,Au)3Sn2化合物異常長大。同時，隨著釬焊時間延長Ni/AuSn/Ni釬焊接頭的剪切強度先增加后減小，釬焊90 s時的剪切強度達到最高12.49 MPa

    Abstract:

    The web AuSn solders and AuSn/Ni joints were prepared by a rolling-annealing method and reflow process, respectively. The effects of the reflow time on the microstructure and the shear properties of the AuSn/Ni joints were investigated. The results show that the molten temperature and chemical composition of the AuSn solder prepared by rolling-annealing method are close to those of the common Au-20Sn eutectic alloy solder. The AuSn/Ni joint formed a fine lamellar eutectic ζ-(Au, Ni)5Sn+δ-(Au, Ni)Sn microstructure after reflow at 330 °C for 30 s. After reflowing for 60 s, a thin and flat layer of (Ni, Au)3Sn2 intermetallic compound (IMC) was formed with some needle-like (Ni,Au)3Sn2 intermetallics. Keeping increasing the reflow time, the (Ni, Au)3Sn2 IMC layer and intermetallics grew significantly. The shear strength of AuSn/Ni joints was improved with reflow time at the beginning, up to the best shear strength of 12.49 MPa at the point of 90 s, and then went down again with further increasing the reflow time.

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韋小鳳,王 檬,王日初,彭超群,馮 艷. AuSn釬料及AuSn/Ni焊點的組織性能研究[J].稀有金屬材料與工程,2013,42(3):639~643.[Wei Xiaofeng, Wang Meng, Wang Richu, Peng Chaoqun, Feng Yan. Microstructure and Properties of AuSn Solder and AuSn/Ni Joint[J]. Rare Metal Materials and Engineering,2013,42(3):639~643.]
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  • 收稿日期:2012-03-14
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