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高銀含量銀包銅粉鍍層結(jié)構(gòu)及性能研究
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昆明理工大學(xué)分析測試基金(2010037)


Plating Layer Structure and Property of Silver-Coated Copper Power with High Silver Content
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    采用化學(xué)鍍法制備具有高銀含量、一定厚度、致密性好的銀包銅粉,用SEM、XRD、粒度分布儀、數(shù)字歐姆表和差熱分析儀表征了鍍銀銅粉和原始銅粉的表面形貌、表面結(jié)構(gòu)及導(dǎo)電性能。結(jié)果表明:高銀含量銀包銅粉表面鍍層致密性好、包覆完全,包覆層厚度達(dá)到336 nm,同時(shí)具有較好的導(dǎo)電性和抗氧化性。

    Abstract:

    The silver-coated copper powder with high silver content, a silver layer of certain thickness and high density was prepared by chemistry plating reaction. The surface morphology, structure and conductivity of the coated powder and the initial powder were characterized by SEM, XRD, LSPSDA, DOM and TG-DTA. Results show that the surface of the silver-coated copper power with high silver content is dense and coated completely, and the coating thickness is up to 336 nm. The powder has good conductivity and oxidation resistance.

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胡 磊,朱曉云.高銀含量銀包銅粉鍍層結(jié)構(gòu)及性能研究[J].稀有金屬材料與工程,2012,41(11):2017~2020.[Hu Lei, Zhu Xiaoyun. Plating Layer Structure and Property of Silver-Coated Copper Power with High Silver Content[J]. Rare Metal Materials and Engineering,2012,41(11):2017~2020.]
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  • 收稿日期:2011-11-27
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