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Cu-Ti+Mo連接2D C/SiC復(fù)合材料與GH783的接頭微結(jié)構(gòu)與性能
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國(guó)家自然科學(xué)基金（90916030）


Microstructure and Properties of 2D C/SiC Composite/GH783 Joint Brazed with Cu-Ti+Mo Composite Filler
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    摘要:

    采用Cu-Ti+Mo復(fù)合焊料，在真空條件下對(duì)2D C/SiC復(fù)合材料和GH783鎳基合金進(jìn)行連接，分析接頭的顯微組織結(jié)構(gòu)，研究Mo含量對(duì)接頭組織及性能的影響。結(jié)果表明：接頭由界面反應(yīng)層、應(yīng)力緩解層、軟金屬層和擴(kuò)散層4個(gè)區(qū)域組成，接頭致密，無孔洞、裂紋等缺陷。隨著Mo含量的增加，接頭的連接強(qiáng)度不斷增加；當(dāng)Mo含量為15%（體積分?jǐn)?shù)）時(shí)，接頭連接強(qiáng)度達(dá)到最大（141 MPa）；當(dāng)Mo含量大于15%時(shí)，接頭的連接強(qiáng)度開始下降。Mo的加入，緩解了接頭的殘余應(yīng)力、抑制了Ti對(duì)C/SiC的過度侵蝕，從而有效提高接頭的連接強(qiáng)度。

    Abstract:

    Using Cu-Ti+Mo composite filler, 2D C/SiC composite was brazed to GH783 nickel-based alloy under vacuum condition. The microstructure of the joint and the effect of Mo content on microstructure and properties of joints were investigated. The results show that the joint is composed of 4 regions: interface reaction layer, stress relief layer, soft metal layer and diffusion layer, without holes, cracks or other defects. The maximal flexural strength reaches 141 MPa with 15% (mass fraction) Mo particles in the joint, and the flexural strength of the joint declines when Mo content exceeds 15%. The Mo addition releases the residual stress of the joint, and inhibits excessive reaction between Ti and C/SiC, thus effectively improving the strength of the joint.

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王 興,成來飛,范尚武,張立同. Cu-Ti+Mo連接2D C/SiC復(fù)合材料與GH783的接頭微結(jié)構(gòu)與性能[J].稀有金屬材料與工程,2012,41(9):1544~1548.[Wang Xing, Cheng Laifei, Fan Shangwu, Zhang Litong. Microstructure and Properties of 2D C/SiC Composite/GH783 Joint Brazed with Cu-Ti+Mo Composite Filler[J]. Rare Metal Materials and Engineering,2012,41(9):1544~1548.]
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  • 收稿日期:2011-09-10
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