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連接溫度對(duì)Ti為中間層鎢/銅合金擴(kuò)散接頭組織和強(qiáng)度的影響
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Effect of Bonding Temperature on Microstructure and Strength of W/CuCrZr Alloy Joints Diffusion Bonded with a Ti Interlayer
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    摘要:

    選取Ti箔作為鎢與銅合金（CuCrZr）連接的中間層，考察了連接溫度對(duì)擴(kuò)散連接接頭的顯微結(jié)構(gòu)和強(qiáng)度性能的影響。結(jié)果表明：擴(kuò)散層中脆性金屬間化合物對(duì)接頭強(qiáng)度有重要影響，當(dāng)連接溫度為1030 ℃時(shí)，Ti與Cu發(fā)生共晶反應(yīng)全部轉(zhuǎn)化為液相并且大部分被擠出連接區(qū)域，少量殘留的金屬間化合物促進(jìn)接頭強(qiáng)度提高，剪切強(qiáng)度甚至超過W母材。

    Abstract:

    Ti interlayer was selected for the bonding of tungsten to CuCrZr alloy. The effects of bonding temperature on the microstructures and shear strength of the joints were investigated. The results show that the brittle intermetallic compound of diffusion layers significantly effect the strength of the joint. The molten is formed due to eutectic reaction between Ti and Cu at 1030 °C, most part of the molten is extruded out from the bonding zone, where a little amount of intermetallic compound is remained in the interfacial layer, resulting in increasing of joint strength. The shearing strength of the joint is even higher than that of W substrate.

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李 軍,楊建鋒,喬冠軍.連接溫度對(duì)Ti為中間層鎢/銅合金擴(kuò)散接頭組織和強(qiáng)度的影響[J].稀有金屬材料與工程,2012,41(7):1235~1238.[Li Jun, Yang Jianfeng, Qiao Guagjun. Effect of Bonding Temperature on Microstructure and Strength of W/CuCrZr Alloy Joints Diffusion Bonded with a Ti Interlayer[J]. Rare Metal Materials and Engineering,2012,41(7):1235~1238.]
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  • 收稿日期:2011-07-25
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