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印刷電路板上化學(xué)鍍鈀工藝研究
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Study on Compound Complexant of Electroless Palladium in Printed Circuit Board
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    摘要:

    采用L9(34) 混合正交體系,系統(tǒng)地研究復(fù)合絡(luò)合劑-乙二胺、乙二胺四乙酸二鈉和丙烯酸在不同工藝參數(shù)和不同添加配比情況下對化學(xué)鍍鈀質(zhì)量的影響,以鍍層的光亮度,鍍液的穩(wěn)定性和沉積速度為評價指標,篩選出最佳的化學(xué)鍍鈀添加劑為:乙二胺0.2 mol/L,乙二胺四乙酸二鈉0.01 mol/L,丙烯酸0.3 mol/L,pH值8。研究結(jié)果表明,優(yōu)化后的化學(xué)鍍鈀鍍液穩(wěn)定性高、沉積速度快、鈀膜與基體鎳鍍層結(jié)合力強、鈀鍍層光亮性好

    Abstract:

    The influences of the process parameters and the concentration of the compound complexant consisting of ethylenediamine, ethylenediaminetetraacetic acid disodium salt (EDTA-2Na) and acrylic acid on the quality of electroless palladium (Pd) were studied using L9(34) orthogonal table. The brightness of Pd coating, the bath stability and the plating speed were taken as assessment standard. The results show that the optimized bath of the electroless Pd is possessed of good stability and high depositing rate. The binding force between Pd film and Ni coating is strong, and Pd film surface is bright. The optimized concentration of ethylenediamine is 0.2 mol/L, EDTA-2Na was 0.01 mol/L, acrylic acid was 0.3 mol/L and pH was 8

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吳道新,劉 迎.印刷電路板上化學(xué)鍍鈀工藝研究[J].稀有金屬材料與工程,2012,41(4):681~684.[Wu Daoxin, LiuYing. Study on Compound Complexant of Electroless Palladium in Printed Circuit Board[J]. Rare Metal Materials and Engineering,2012,41(4):681~684.]
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  • 收稿日期:2011-04-08
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