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MEMS微器件電沉積層均勻性的研究進展
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國家自然科學基金項目(50875116);江蘇省自然科學基金項目(BK2006043)


Research Progress on Uniformity of MEMS Micro-Device Electrodeposition
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    摘要:

    有效地改善沉積層厚度均勻性是電化學沉積技術應用的關鍵,簡述了微電鑄原理,綜述了國內外微器件沉積層均勻性的最新研究進展,包括優(yōu)化工藝參數(shù)、脈沖電流與換向脈沖電流、改善傳質條件、輔助陰極、陰極屏蔽、陽極特性及數(shù)值模擬仿真技術改善沉積層均勻性的研究報道,詳細介紹了超臨界CO2電化學沉積新方法及其優(yōu)點,并展望了今后的研究重點及發(fā)展方向。

    Abstract:

    The ability to control the uniformity of electrodeposition is the key to successful application of electrodeposition technology such as electroplating and electroforming. The principle of micro-electroforming is briefly introduced. The latest research progresses of the thickness uniformity of micro-device electrodeposition at home and abroad are summarized, including optimization of parameters in electrodeposition, modification of current density and application of modulated current, metal ion transportation, auxiliary cathode, shields and baffles, careful control of anode properties, numerical simulation. A new electroplating method in supercritical carbon dioxide and its advantages are presented in detail. Finally, the research focus and future aspects about the uniformity are proposed.

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王星星,雷衛(wèi)寧,劉維橋,姜 博,鄒 旻. MEMS微器件電沉積層均勻性的研究進展[J].稀有金屬材料與工程,2011,40(12):2245~2251.[Wang Xingxing, Lei Weining, Liu Weiqiao, Jiang Bo, Zou Min. Research Progress on Uniformity of MEMS Micro-Device Electrodeposition[J]. Rare Metal Materials and Engineering,2011,40(12):2245~2251.]
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  • 收稿日期:2010-12-14
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