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Cu含量對(duì)Ag-Cu釬料釬焊透氧膜
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國(guó)家高技術(shù)研究發(fā)展計(jì)劃項(xiàng)目 (2006AA11A189)；上海市科委博士后資助項(xiàng)目 (D10011009023)


Effect of Cu Content on Interface Microstructures of Oxygen-Permeable Membrane Brazed with Ag-Cu Brazing Filler
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    摘要:

    采用Ag-Cu釬料用于透氧膜與不銹鋼支撐體之間的封接，研究了Cu含量對(duì)Ag-Cu釬料釬焊透氧膜界面結(jié)構(gòu)的影響。利用SEM對(duì)連接界面的顯微組織進(jìn)行觀察，并用EDS對(duì)界面的相組成進(jìn)行分析。結(jié)果表明：純Ag與透氧膜陶瓷之間的連接界面無元素互擴(kuò)散；Ag中少量1 at%Cu的添加并未明顯改善釬焊連接界面；當(dāng)Cu含量增加到3.3 at%時(shí)，在透氧膜一側(cè)生成一層由Cu和Ag擴(kuò)散所致的厚度約200 μm的反應(yīng)層，反應(yīng)層的生成表明Ag-3.3Cu釬料與透氧膜之間具有良好的潤(rùn)濕性和界面結(jié)合。

    Abstract:

    Ag-Cu brazing filler were adopted to seal oxygen-permeable membrane ceramics and stainless steel support, and the effect of Cu content on interface microstructure of oxygen-permeable membrane brazed with Ag-Cu brazing filler was investigated. The microstructure of the interface was observed by SEM and the constituent phases were analyzed by EDS. The results show that no elemental interdiffusion occurs in the interface of pure Ag and oxygen-permeable membrane; the addition of 1 at%Cu doesn’t improve the bonding of the interface obviously; when the Cu content reaches 3.3 at%, a reaction layer of about 200 μm in thickness forms on the membrane side due to the diffusion of Cu and Ag, which indicates the good wetting ability and interface bonding between Ag-3.3Cu brazing filler and oxygen-permeable membrane.

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王 方,張玉文,丁偉中,魯雄剛. Cu含量對(duì)Ag-Cu釬料釬焊透氧膜[J].稀有金屬材料與工程,2011,40(10):1832~1835.[Wang Fang, Zhang Yuwen, Ding Weizhong, Lu Xionggang. Effect of Cu Content on Interface Microstructures of Oxygen-Permeable Membrane Brazed with Ag-Cu Brazing Filler[J]. Rare Metal Materials and Engineering,2011,40(10):1832~1835.]
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  • 收稿日期:2010-10-21
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