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Ni/P/Ce元素對(duì)SnAgCu無(wú)鉛釬料性能和組織的影響
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“十一五”國(guó)家科技支撐重點(diǎn)項(xiàng)目(2006BAE03B02)


Effects of Ni/P/Ce Elements on the Properties and Microstructure of SnAgCu Lead-Free Solders
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    摘要:

    研究添加微量單一Ni、P或稀土Ce元素對(duì)Sn3.0Ag0.5Cu(質(zhì)量分?jǐn)?shù), %)無(wú)鉛釬料熔化溫度、潤(rùn)濕性能、時(shí)效前后釬焊接頭的剪切強(qiáng)度和顯微組織的影響。結(jié)果表明：?jiǎn)我籒i、P和稀土Ce元素的添加，對(duì)Sn3.0Ag0.5Cu釬料合金的熔化溫度影響很?。籔元素的加入能夠增大合金的潤(rùn)濕力，縮小潤(rùn)濕時(shí)間。加入單一的Ni或稀土Ce元素對(duì)合金的潤(rùn)濕性能和接頭時(shí)效前的剪切強(qiáng)度影響不大，但能夠很好地抑制高溫時(shí)效引起的接頭剪切強(qiáng)度的下降。此外，P 元素的添加明顯地改善了合金的抗氧化性能，但稀土Ce元素的添加對(duì)其有所惡化。這些性能的改變與微量Ni、P或稀土Ce元素對(duì)其顯微組織的影響有關(guān)

    Abstract:

    Effects of trace Ni, P or Ce element additions on the microstructure and the properties of the Sn3.0Ag0.5Cu solder alloy were investigated. Results show that single adding of Ni, P or Ce has little influence on the melting temperature of the Sn3.0Ag0.5Cu solder alloy. P addition can improve the wettability of the solder, i.e. the wetting force of the solder is increased, and the wetting time is decreased. Single adding of Ni or Ce has no significant effect on the wettability of the soldered alloy and the shear strength of the as-reflowed soldered joint, but can remarkably suppress the decrease of the shear strength of the solder joints due to the high-temperature aging. Besides, P addition significantly increases the oxidation resistance of the soldered alloy, but rare earth Ce addition deteriorates it. The property change of the Sn3.0Ag0.5 solder are attributed to the change of the microstructure caused by trace Ni, P, or rare earth Ce additions

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董文興,史耀武,雷永平,夏志東,郭 福. Ni/P/Ce元素對(duì)SnAgCu無(wú)鉛釬料性能和組織的影響[J].稀有金屬材料與工程,2010,39(10):1759~1763.[Dong Wenxing, Shi Yaowu, Lei Yongping, Xia Zhidong, Guo Fu. Effects of Ni/P/Ce Elements on the Properties and Microstructure of SnAgCu Lead-Free Solders[J]. Rare Metal Materials and Engineering,2010,39(10):1759~1763.]
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  • 收稿日期:2009-10-23
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