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納米Ag顆粒增強(qiáng)復(fù)合釬料蠕變性能的研究
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北京市科技新星計(jì)劃(2004B03)；霍英東基金(104016)


Creep Properties of Ag Nanoparticle Reinforced Sn-Cu Composite Solders
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    摘要:

    制備納米Ag顆粒增強(qiáng)的Sn-Cu基復(fù)合釬料。研究不同溫度載荷下復(fù)合釬料釬焊接頭的蠕變斷裂壽命，并與Sn-0.7Cu基體釬料釬焊接頭進(jìn)行對比。此外，確定納米Ag顆粒增強(qiáng)的Sn-Cu基復(fù)合釬料釬焊接頭在不同溫度和應(yīng)力水平下的應(yīng)力指數(shù)和蠕變激活能，建立復(fù)合釬料釬焊接頭的穩(wěn)態(tài)蠕變本構(gòu)方程。結(jié)果表明，在不同的溫度和應(yīng)力下，與Sn-0.7Cu釬料釬焊接頭相比，納米Ag顆粒增強(qiáng)的Sn-Cu基復(fù)合釬料釬焊接頭的蠕變斷裂壽命均有所提高，且具有更高的蠕變激活能，說明復(fù)合釬料釬焊接頭具有更優(yōu)的抗蠕變性能

    Abstract:

    Reinforced Ag nanoparticles were incorporated into Sn-0.7Cu matrix composite solder by a mechanical means in order to improve the creep properties of the solder matrix. The creep-rupture life was studied of Sn-0.7Cu solder joints and composite solder joints reinforced with Ag nanoparticles at different temperatures and applied stresses. Stress exponents and creep activation energy were calculated for Ag nanoparticle reinforced Sn-Cu matrix composite solder joints at different temperatures and stress levels. Steady-state creep constitutive equation of the composite solder joint was established. Results show that at different temperatures and stresses, Ag nanoparticles reinforced Sn-Cu composite solder joints have higher creep rupture life and creep activation energy than Sn-0.7Cu solder joints. It indicates the creep resistance of the composite solder joint with 1 vol% Ag reinforcement addition is better than that of Sn-0.7Cu solder joint

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邰 楓,郭 福,申 灝,劉建萍.納米Ag顆粒增強(qiáng)復(fù)合釬料蠕變性能的研究[J].稀有金屬材料與工程,2010,39(6):1005~1008.[Tai Feng, Guo Fu, Shen Hao, Liu Jianping. Creep Properties of Ag Nanoparticle Reinforced Sn-Cu Composite Solders[J]. Rare Metal Materials and Engineering,2010,39(6):1005~1008.]
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  • 收稿日期:2009-05-11
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