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微連接用Sn-2.5Ag-0.7Cu(0.1RE)釬料焊點(diǎn)界面Cu6Sn5的長(zhǎng)大行為
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國(guó)家自然科學(xué)基金（50774029）；河南省高校創(chuàng)新人才基金（教高2004-294）；河南省高校杰出科研人才創(chuàng)新工程項(xiàng)目（2004KYCX020）；河南省杰出青年科學(xué)基金（074100510011）


Growth Behavior of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu(0.1RE) Solder Joints for Micro-Joining
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    摘要:

    利用XRD、SEM及EDAX研究了釬焊和時(shí)效過(guò)程中低銀Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊點(diǎn)界面區(qū)顯微組織和Cu6Sn5金屬間化合物的生長(zhǎng)行為。結(jié)果表明，釬焊過(guò)程中焊點(diǎn)界面區(qū)Cu6Sn5金屬間化合物的厚度是溶解和生長(zhǎng)兩方面共同作用的結(jié)果；隨時(shí)效時(shí)間的增加，焊點(diǎn)界面區(qū)Cu6Sn5的形貌由扇貝狀轉(zhuǎn)變?yōu)閷訝?，其長(zhǎng)大動(dòng)力學(xué)符合拋物線規(guī)律，由擴(kuò)散機(jī)制控制；添加0.1%（質(zhì)量分?jǐn)?shù)，下同）的RE能有效減慢界面Cu6Sn5金屬間化合物在釬焊及時(shí)效過(guò)程中的長(zhǎng)大速度，改變焊點(diǎn)的斷裂機(jī)制，提高其可靠性。

    Abstract:

    The microstructure of low-Ag-content Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface and growth behavior of Cu6Sn5 intermetallic compound (IMC) were investigated by XRD, SEM and EDAX. The results show that the Cu6Sn5 thickness of the solder joint interface is decided by its dissolution and growing during soldering. With the aging time increasing, the Cu6Sn5 morphology of the solder joint interface changed from scallop-like to lamellar; the growth dynamics follows the parabola law and its growth behavior is controlled by diffusion mechanism. Addition of 0.1% RE (mass fraction) in the Sn-2.5Ag-0.7Cu solder alloy can effectively reduce the growing rate of the solder joint Cu6Sn5 IMC during the soldering and aging period, and change the fracture mechanism of solder joint; therefore the reliability of the solder joint can be greatly improved.

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王要利,張柯柯,劉 帥,趙國(guó)際.微連接用Sn-2.5Ag-0.7Cu(0.1RE)釬料焊點(diǎn)界面Cu6Sn5的長(zhǎng)大行為[J].稀有金屬材料與工程,2010,39(1):117~121.[Wang Yaoli, Zhang Keke, Liu Shuai, Zhao Guoji. Growth Behavior of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu(0.1RE) Solder Joints for Micro-Joining[J]. Rare Metal Materials and Engineering,2010,39(1):117~121.]
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  • 收稿日期:2009-01-15
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