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粒度配比法制備近全致密W/Cu20復(fù)合材料
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Fabrication of W/Cu20 Composite Materials with Nearly Full Density by Particle Size Distribution Method
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National Outstanding Young Scientist Foundation of China (50125415)

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    摘要:

    選用A、B兩種不同粒度的W粉,調(diào)節(jié)A、B鎢粉的比例,并與Cu粉直接混合,配制成W/Cu20(質(zhì)量分?jǐn)?shù)%,下同)混合粉末,經(jīng)熱壓制備了近全致密的W-Cu復(fù)合材料。顯微組織觀察表明,隨著小粒度W粉配比的增加,大W顆粒形成的孔隙逐漸減少,而小W顆粒形成的孔隙逐漸增加。當(dāng)W粒度配比為80%A+20%B時(shí),形成較為致密的堆積結(jié)構(gòu)。在合適的工藝條件下(燒結(jié)溫度1060 ℃、壓力85 MPa、保溫3 h),所制備的W/Cu20復(fù)合材料其相對(duì)密度達(dá)到98.6%,Cu相沿大W顆粒和小W顆粒的邊界呈現(xiàn)網(wǎng)狀分布。

    Abstract:

    In order to fabricate highly dense W/Cu20 (mass fraction, similarly hereinafter) composite materials, two kinds of tungsten powder with different particle size, A and B, were used. The W powder with different ratios of A and B were directly mixed with copper powder and W/Cu20 mixed powder was obtained. Almost fully dense W-Cu composite materials were fabricated by solid-state hot pressing. The observation of microstructure shows that with increasing of the fine W powder (B) content, the pores formed by the coarse W powder (A) decrease and the pores by the fine W powder increase gradually. Rather dense microstructure is obtained when the W particle distribution is 80%A+20%B. The W/Cu20 with 98.6% relative density is obtained under the processing conditions of sintering temperature of 1060 °C, pressure of 85 MPa and holding time of 3 h. Copper forms into a network structure around the coarse W particles and the fine W particles.

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劉彬彬,陳江華,謝建新.粒度配比法制備近全致密W/Cu20復(fù)合材料[J].稀有金屬材料與工程,2010,39(1):17~21.[Liu Binbin, Chen Jianghua, Xie Jianxin. Fabrication of W/Cu20 Composite Materials with Nearly Full Density by Particle Size Distribution Method[J]. Rare Metal Materials and Engineering,2010,39(1):17~21.]
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  • 收稿日期:2009-01-13
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