最新色国产精品精品视频,中文字幕日韩一区二区不卡,亚洲有码转帖,夜夜躁日日躁狠狠久久av,中国凸偷窥xxxx自由视频

+高級檢索
AlN/Mo-Ni-Cu的活性封接研究
DOI:
作者:
作者單位:

作者簡介:

通訊作者:

中圖分類號:

基金項目:

國家“973”項目（2006CB605207）


Study on Active Brazing of AlN Ceramics and Mo-Ni-Cu Alloy
Author:
Affiliation:

Fund Project:

  • 摘要
    • |
  • 圖/表
    • |
  • 訪問統(tǒng)計
    • |
  • 參考文獻
    • |
  • 相似文獻
    • |
  • 引證文獻
    • |
  • 資源附件
    • |
  • 文章評論
    摘要:

    采用Ag70-Cu28-Ti2活性焊料在真空條件下對AlN陶瓷和Mo-Ni-Cu合金進行活性封焊。分析焊區(qū)的顯微組織形態(tài)、相組成，測定焊區(qū)力學性能和氣密性。結果表明：在焊料層與合金的界面處Cu的含量相對較高，而在AlN陶瓷與焊料層的界面處形成了厚度為1~2 μm的富Ti層；經XRD分析發(fā)現，AlN陶瓷與焊料層的界面上有TiN存在，表明在AlN陶瓷與焊料層的界面處形成了化學鍵合。焊接后試樣的氣密性達到1.0×10-11 Pa·m3/s，抗彎強度σb=78.55 MPa，剪切強度στ=189.58 MPa。

    Abstract:

    AlN ceramics and Mo-Ni-Cu alloy were brazed actively by Ag70-Cu28-Ti2 active solder in vacuum. The microstructure and phase composition of the brazed zone were analyzed and its mechanical properties and gas leakage were tested. Results show that Cu content is relatively high in the interface between the solder layer and the alloy; while Ti-rich layer with 1-2 μm thickness forms in the interface between the solder layer and AlN ceramics, where TiN is found by XRD, which indicates that there is chemical bonding in the AlN-solder interface. The gas leakage rate of the sample was 1.0 ×10-11 Pa·m3/s, and the bending strength and shear strength were σｂ=78.55 MPa, and στ=189.58 MP, respectively.

    參考文獻
    相似文獻
    引證文獻
引用本文

張玲艷,秦明禮,曲選輝,陸艷杰,張小勇. AlN/Mo-Ni-Cu的活性封接研究[J].稀有金屬材料與工程,2009,38(12):2159~2162.[Zhang Lingyan, Qin Mingli, Qu Xuanhui, Lu Yanjie, Zhang Xiaoyong. Study on Active Brazing of AlN Ceramics and Mo-Ni-Cu Alloy[J]. Rare Metal Materials and Engineering,2009,38(12):2159~2162.]
DOI：[doi]

復制
文章指標
  • 點擊次數:
  • 下載次數:
  • HTML閱讀次數:
  • 引用次數:
歷史
  • 收稿日期:2008-11-30
  • 最后修改日期:2009-09-17
  • 錄用日期:
  • 在線發(fā)布日期:
  • 出版日期: