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鈹材切削加工溫度場和應(yīng)力場的數(shù)值模擬
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中國工程物理研究院重大基金及表面物理與化學(xué)國家重點(diǎn)實(shí)驗(yàn)室基金(2005Z0302、SPC200705 )


Numerical Simulation of Temperature and Stress Fields in Beryllium Cutting Process
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    摘要:

    采用MSC.Marc軟件對鈹材切削加工溫度場和應(yīng)力場進(jìn)行熱力耦合有限元分析,鈹材本構(gòu)關(guān)系采用Johnson-Cook模型,編寫子程序模擬鈹材切削斷裂分離現(xiàn)象。結(jié)果表明:鈹材切削加工過程溫升不明顯,最高溫度約45 ℃,切削后工件表面平行和垂直于走刀方向殘余應(yīng)力分量均為拉應(yīng)力;采用工藝獲得鈹材切削穩(wěn)定狀態(tài)下切削力和進(jìn)給力分別為280和–250 N/mm。此研究有助于加深鈹材切削應(yīng)力形成規(guī)律認(rèn)識以及切削工藝參數(shù)優(yōu)化

    Abstract:

    Using the MSC.Marc software, the temperature and stress fields in beryllium during cutting process are studied by employing a thermo-mechanically coupled finite element method (FEM). The constitutive equation of beryllium is fitted with the Johnson-Cook plasticity model, and an user subroutine is written for modeling the chip separation after fracturing. The results show that the temperature in beryllium increases only a little and the highest temperature is about 45 ℃. Both of the residual stress components for parallel and vertical to the cutting direction are tensile on the surface of beryllium after cutting. The cutting force and thrust force are 280 and –250 N/mm, respectively, during the cutting steady state if the cutting process is adopted in this paper. This study is helpful to enhance the understanding for stress formation and the optimizing for the beryllium cutting process.

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董 平,李瑞文.鈹材切削加工溫度場和應(yīng)力場的數(shù)值模擬[J].稀有金屬材料與工程,2009,38(9):1622~1625.[Dong Ping, Li Ruiwen. Numerical Simulation of Temperature and Stress Fields in Beryllium Cutting Process[J]. Rare Metal Materials and Engineering,2009,38(9):1622~1625.]
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  • 收稿日期:2008-09-07
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