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TC21鈦合金的擴(kuò)散連接研究
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Study of Diffusion Bonding of Fine Grain TC21 Titanium Alloy
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Program of Excellent Team in Harbin Institute of Technology

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    摘要:

    研究并分析TC21鈦合金擴(kuò)散連接接頭的微觀組織、界面結(jié)合質(zhì)量、顯微硬度和壓縮變形率隨連接工藝參數(shù)的變化規(guī)律。結(jié)果表明:連接溫度的提高及連接時(shí)間的延長(zhǎng)分別導(dǎo)致擴(kuò)散系數(shù)的增大和擴(kuò)散程度的增加,同時(shí)變形能力增大,因而界面焊合率提高,但接頭變形率增大;在880 ℃的連接溫度下,只要連接時(shí)間介于15~30 min,界面焊合率就能達(dá)到100%,而接頭變形率可控制在10%以內(nèi)。接頭顯微硬度隨連接溫度的升高而明顯提高,但隨連接時(shí)間的變化存在峰值。對(duì)接頭微觀組織特征的分析表明:連接溫度越高,兩相長(zhǎng)大速率越快,兩相尺寸增大;但當(dāng)連接溫度達(dá)到980 ℃時(shí),被焊母材處于β單相區(qū),較快的冷卻速度下α相不能完全析出,接頭微觀組織因此變?yōu)閷悠瑺畹膬上嘟M織。隨著連接時(shí)間的延長(zhǎng),兩相尺寸先增大,當(dāng)連接時(shí)間延長(zhǎng)到90 min后,高溫下由α相轉(zhuǎn)變而來(lái)的β相增多并被保留下來(lái),割裂了原有的兩相,使兩相尺寸減小。正是接頭微觀組織的這種變化特征,決定了顯微硬度的變化規(guī)律

    Abstract:

    The diffusion bonding of TC21 titanium alloy with initial grain size of 2 μm was performed at 780-980 oC for 5-90 min. The microstructure, bonding quality, microhardness and deformation ratio of the joints were analyzed. It is found that the interface bonding ratio can achieve 100% and the deformation ratio can be controlled within 10% when diffusion bonding is performed at 880 oC for 15-30 min. The microhardness of the joints increases with increasing of bonding temperature, but it shows a peak value as the bonding time is prolonged. When the joint is bonded at 880-930 oC, fully equiaxed structures are observed, and with increasing of bonding temperature, the sizes of α and β phases are increased; but when bonding temperature is up to 980 ℃, fully lamellar structures are obtained. When the joint is bonded at 880 oC for 5-60 min, the size of α and β phases increases with prolonging of bonding time. However, when the bonding time is prolonged to 90 min, the sizes of α and β phases decrease slightly

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劉會(huì)杰,馮秀麗. TC21鈦合金的擴(kuò)散連接研究[J].稀有金屬材料與工程,2009,38(9):1509~1513.[Liu Huijie, Feng Xiuli. Study of Diffusion Bonding of Fine Grain TC21 Titanium Alloy[J]. Rare Metal Materials and Engineering,2009,38(9):1509~1513.]
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  • 收稿日期:2008-09-12
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