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SnAgCu系無鉛釬料合金力學(xué)性能及釬焊性能研究
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西安石油大學(xué)陜西省材料加工工程重點學(xué)科項目;西安石油大學(xué)青年基金(2005-47)


Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
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    摘要:

    利用光學(xué)顯微鏡、掃描電子顯微鏡(SEM)和能譜分析儀(EDX)及Instron電液伺服疲勞拉伸試驗機,對SnAgCu系無鉛釬料合金的力學(xué)性能和釬焊性能進行了研究。結(jié)果表明,適量的稀土元素Ce的添加顯著地延長了Sn3Ag2.8Cu釬焊接頭在室溫下的蠕變斷裂壽命,Sn3Ag2.8Cu-0.1Ce釬焊接頭的蠕變斷裂壽命超過Sn3Ag2.8Cu釬料的9倍;同時,使Sn3Ag2.8Cu合金的延伸性能也得到了顯著改善,伸長率達到15.7%;Sn3Ag2.8Cu-0.1Ce與銅基板的擴散層厚度比Sn37Pb厚,但是比S

    Abstract:

    The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy(SEM), energy dispersive X-ray(EDX) and Instron electrohydraulic servo fatigue tensile tester. The results indicate that proper quantities of Ce can remarkably prolong the creep-rupture life of the Sn3Ag2.8Cu brazing joint at room temperature, and the creep-rupture life of the Sn3Ag2.8Cu-0.1Ce brazing joint is 9 times or more than that of the Sn3Ag2.8Cu; meanwhile, the elongation of the Sn3.0Ag2.8Cu-0.1Ce solder alloy is also obviously improved even up to 15.7%; the intermetallic layers of the Sn3Ag2.8Cu-0.1Ce with copper plate are thicker than that of Sn37Pb, but thinner than that of Sn3Ag2.8Cu.

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許天旱,金志浩,王黨會. SnAgCu系無鉛釬料合金力學(xué)性能及釬焊性能研究[J].稀有金屬材料與工程,2009,38(8):1462~1466.[Xu Tianhan, Jin Zhihao, Wang Danghui. Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy[J]. Rare Metal Materials and Engineering,2009,38(8):1462~1466.]
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  • 收稿日期:2008-07-31
  • 最后修改日期:2009-05-25
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