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Ag-Cu-Ti釬焊金剛石的界面結(jié)構(gòu)及熱應(yīng)力分析
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國家自然科學(xué)基金（50175052）；江蘇省自然科學(xué)基金（BK20001049）


Interface Microstructure and Thermal Stress of Diamond Brazing with Ag-Cu-Ti Filler
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    摘要:

    采用Ag-Cu-Ti釬料對金剛石進(jìn)行真空釬焊實驗，實現(xiàn)了金剛石與鋼基體的高強度連接。采用SEM對金剛石與釬料界面、金剛石表面碳化物形貌進(jìn)行觀察分析，采用EDS分析金剛石表面碳化物的成分，利用XRD對焊后金剛石磨料的進(jìn)行物相分析，采用Raman光譜對焊后的金剛石是否石墨化、殘余應(yīng)力進(jìn)行分析。結(jié)果表明：Ag-Cu-Ti釬料中的Ti元素在界面處發(fā)生偏析，并在金剛石表面生成尺寸小于1 μm的塊狀TiC。金剛石在焊接過程的高溫下沒有發(fā)生石墨化。金剛石中的最大拉應(yīng)力位于磨粒頂部，為60 MPa，最大壓應(yīng)力在底部，為120 MPa。最后在界面上形成了金剛石/TiC/釬料/鋼基體的梯度結(jié)合層。

    Abstract:

    A firm joint between steel base and diamond was realized by using Ag-Cu-Ti brazing diamond in vacuum. The interface between diamond and filler and carbide formed on the diamond surface was analyzed by using SEM, EDS, XRD and Raman Spectroscope. Results showed that carbide layer was formed as a result of the reaction between Ti and diamond, and discontinuous-lump-like TiC carbide with less than 1 μm on the surface of diamond appeared. There was almost no heat damage in the brazed diamond. The maximal tensile stress in the diamond located at the top reached 60 MPa, while the maximal compressive stress located at the bottom was 120 MPa. As a result, the metallurgical bonding was obtained between filler metal and diamond through the forming the serial of diamond-TiC-filler layer.

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盧金斌,徐九華. Ag-Cu-Ti釬焊金剛石的界面結(jié)構(gòu)及熱應(yīng)力分析[J].稀有金屬材料與工程,2009,38(4):642~646.[Lu Jinbin, Xu Jiuhua. Interface Microstructure and Thermal Stress of Diamond Brazing with Ag-Cu-Ti Filler[J]. Rare Metal Materials and Engineering,2009,38(4):642~646.]
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  • 收稿日期:2008-04-08
  • 最后修改日期:2009-02-11
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