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P對(duì)Au/Ni/Cu焊盤與SnAgCu焊點(diǎn)焊接界面可靠性的影響
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“十一五”總裝備部預(yù)研項(xiàng)目（51323060305）；信息產(chǎn)業(yè)部電子第五研究所科技發(fā)展基金（XF0726130）資助


Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
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    摘要:

    采用回流焊工藝在ENIG鍍層印制電路板上組裝289 I/Os 無(wú)鉛Sn-3.0Ag-0.5Cu 球柵陣列封裝器件，對(duì)封裝后的電路板進(jìn)行隨機(jī)振動(dòng)可靠性試驗(yàn)，采用X-Ray、SEM和EDX等測(cè)試確定焊點(diǎn)在隨機(jī)振動(dòng)試驗(yàn)過(guò)程中的失效機(jī)制，探討焊點(diǎn)沿界面失效與鍍層內(nèi)P元素的分布和含量的關(guān)系。在振動(dòng)試驗(yàn)中失效和未失效的BGA焊點(diǎn)與鍍層界面表現(xiàn)出類似的微觀形貌，Ni層因被氧化腐蝕而在焊點(diǎn)截面形貌上出現(xiàn)“缺齒”痕跡，而在表面形貌圖上此呈現(xiàn)黑色的氧化腐蝕裂紋。P在鍍層表面的聚集對(duì)Ni的氧化腐蝕有促進(jìn)作用，同時(shí)P的聚集也明顯

    Abstract:

    The content and distributing of P in Electroless Nickel/Immersion Gold (ENIG) surface finishes effect the reliability of interface between solder joint and surface finishes. 289 I/Os lead-free Sn-3.0Ag-0.5Cu BGAs was assembled on the ENIG print circuit board by reflow soldering technology. The print circuit board was tested by random vibration. After random vibration test, the failure and not failure samples were studied by X-ray, SEM, and EDX et al. The failure mechanism was confirmed and the relation of failure and content and distributing of P in ENIG finishes was discussed. The failure and not failure samples after vibration test show similar microstructure at the interface of solder joint and surface finishes. The cross-sectioning of the affected area shows a “tooth decay” effect of corrosion of the nickel layer, and “mud cracks” in the topography on the surface. The enrichment of P on the surface accelerated the oxidation of Ni, and also reduced the mechanical intensity of interface. The oxidation of Ni and the enrichment of P on the surface result in the crack of solder/finish interface

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陸裕東,何小琦,恩云飛,王 歆,莊志強(qiáng). P對(duì)Au/Ni/Cu焊盤與SnAgCu焊點(diǎn)焊接界面可靠性的影響[J].稀有金屬材料與工程,2009,38(3):477~480.[Lu Yudong, He Xiaoqi, En Yunfei, Wang Xin, Zhuang Zhiqiang. Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint[J]. Rare Metal Materials and Engineering,2009,38(3):477~480.]
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  • 收稿日期:2008-03-11
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