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BGA焊點(diǎn)剪切性能的評價(jià)
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國家“863”高科技發(fā)展計(jì)劃(2002AA322040)；“十一五”國家科技支撐重點(diǎn)項(xiàng)目(2006BAE03B02)；北京市自然科學(xué)基金資助(012003)；北京市屬市管高等學(xué)校人才強(qiáng)教計(jì)劃資助項(xiàng)目；2006高等學(xué)校博士學(xué)科點(diǎn)專項(xiàng)科研基金(20060005006)


Evaluation on the Shear Properties of BGA Solder Joint
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    摘要:

    設(shè)計(jì)了用單個(gè)微焊球和兩塊帶焊盤的FR4板焊接而成的搭接接頭，研究了不同稀土含量及不同加載速率對接頭強(qiáng)度及塑性的影響。結(jié)果表明，微量稀土(質(zhì)量分?jǐn)?shù)<0.25%)不但能提高焊點(diǎn)的剪切強(qiáng)度，而且可以改善焊點(diǎn)的塑性。而當(dāng)稀土含量進(jìn)一步增加時(shí)，焊點(diǎn)的強(qiáng)度及塑性均下降。焊點(diǎn)的剪切強(qiáng)度及伸長量隨應(yīng)變速率的增加而增加。通過對焊點(diǎn)顯微組織的分析可知，微量稀土可顯著細(xì)化焊點(diǎn)的顯微組織，特別是抑制了釬料內(nèi)部及界面處金屬間化合物的生長，從而改善了焊點(diǎn)的力學(xué)性能。對斷口形貌的分析同樣證明了伸長量隨剪切速率增加而增加

    Abstract:

    In this paper, soldered lap joint specimens were fabricated by a solder reflow process using a Sn-3.8Ag-0.7Cu-xRE (x=0, 0.1wt%, 0.25wt%, 0.5wt%) BGA solder ball on FR4 substrate parts. The effects of rare earth(RE) content and strain rate on the shear properties of soldered lap joint were investigated. The Results show that the addition of minute RE (<0.25wt%) can improve the shear strength and elongation of the lap joint. However, further increasing of RE content would degrade the shear properties of the lap joint. The shear strength and elongation of the lap joint increase with the increase of strain rate. The analysis of the microstructure and fractograph indicated that through the addition of minute RE, the microstructure of the lap joint was refined, especially the growth of intermetallic compound was inhibited, and thus the shear properties of the lap joint were improved. In addition, the observation of fractographs confirmed that the elongation of the lap joint increase with the increase of strain rate

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于 洋,史耀武,夏志東,雷永平,郭 福,李曉延. BGA焊點(diǎn)剪切性能的評價(jià)[J].稀有金屬材料與工程,2009,38(3):468~472.[Yu Yang, Shi Yaowu, Xia Zhidong, Lei Yongping, Guo Fu, Li Xiaoyan. Evaluation on the Shear Properties of BGA Solder Joint[J]. Rare Metal Materials and Engineering,2009,38(3):468~472.]
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  • 收稿日期:2008-03-11
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