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具有Al2O3阻擋層的HfO2柵介質(zhì)膜的界面和電學(xué)性能的表征
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Interfacial and Electrical Characterization of HfO2 Gate Dielectric Film with a Blocking Layer of Al2O3
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Supported by National Natural Science Foundation of China (50402026)

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    摘要:

    研究了經(jīng)過(guò)700 ℃快速熱退火的并在Si界面處插入Al2O3阻擋層的HfO2柵介質(zhì)膜的界面結(jié)構(gòu)和電學(xué)性能。X射線(xiàn)光電子譜表明,退火后,界面層中的SiOx轉(zhuǎn)化為化學(xué)當(dāng)量的SiO2,而且未發(fā)現(xiàn)鉿基硅酸鹽和鉿基酸化物。由電學(xué)測(cè)試提取出等效柵氧厚度為2.5 nm, 固定電荷密度為–4.5×1011/cm2。發(fā)現(xiàn)Al2O3阻擋層能有效地阻止Si原子擴(kuò)散進(jìn)入HfO2薄膜,進(jìn)而改善HfO2柵介質(zhì)膜的界面和電學(xué)性能

    Abstract:

    HfO2 gate dielectric films with a blocking layer of Al2O3 inserted between HfO2 layer and Si layer (HfO2/Si) were treated with rapid thermal annealing process at 700 ℃. The interfacial structure and electrical properties were reported. The results of X-ray photoelectron spectroscopy showed that the interfacial layer of SiOx transformed into SiO2 after the annealing treatment, and Hf-silicates and Hf-silicides were not detected. The results of high-resolution transmission electron microscopy indicated that the interfacial layer was composed of SiO2 for the annealed film with blocking layer. The results of the electrical measurements indicated that the equivalent oxide thickness decreased to 2.5 nm and the fixed charge density decreased to –4.5×1011/cm2 in comparison with the same thickness of HfO2 films without the blocking layer. Al2O3 layer could effectively prevent the diffusion of Si into HfO2 film and improve the interfacial and electrical performance of HfO2 film

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程新紅,何大偉,宋朝瑞,俞躍輝,沈達(dá)身.具有Al2O3阻擋層的HfO2柵介質(zhì)膜的界面和電學(xué)性能的表征[J].稀有金屬材料與工程,2009,38(2):189~192.[Cheng Xinhong, He Dawei, Song Zhaorui, Yu Yuehui, Shen Dashen. Interfacial and Electrical Characterization of HfO2 Gate Dielectric Film with a Blocking Layer of Al2O3[J]. Rare Metal Materials and Engineering,2009,38(2):189~192.]
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  • 收稿日期:2008-01-27
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