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TiC對CuW觸頭材料組織與性能的影響
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TG146.23 TG146.11

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國家自然科學基金資助項目（50474012）


Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials
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    摘要:

    采用粉末冶金-熔滲法制備了不同TiC添加量的CuW合金。研究了添加TiC對CuW材料靜態(tài)性能、真空電擊穿性能及顯微組織的影響。結(jié)果表明：TiC的添加量在0～1．2％（質(zhì)量分數(shù)，下同）時，隨著添加量的增加，合金的硬度逐漸升高，而電導率變化不大；當添加量在1．2％～2．0％范圍內(nèi)時，硬度和電導率則大幅下降。添加TiC相提高了CuW材料的耐電壓強度，降低了截流值。對真空電擊穿后的表面組織形貌分析發(fā)現(xiàn)，由于TiC相在鎢骨架上的釘扎作用，銅液的飛濺較??；電擊穿發(fā)生在Cu／TiC相界面上，且擊穿坑較小。

    Abstract:

    A series of Cu-W alloys added with TiC particles were prepared by means of powder metallurgy-infiltration process. The effects of TiC addition on the microstructure and properties were investigated for the Cu-W alloys, respectively, including the static property and the vacuum breakdown property. The results showed that the hardness of W-Cu alloys increased with increasing percentage of TiC, while the electric conductivity changed slightly for TiC addition in the range of 0wt %-1.2wt%, but dramatical decreases were observed for TiC addition from 1.2wt% to 2wt%. The dielectric strength was improved and the chopping current of was decreased by TiC phase addition. The metallographic analysis of Cu-W alloys after vacuum breakdown showed that the splash of liquid copper was decreased because the TiC phase nailed on the skeletons of tungsten. The vacuum breakdown took place in interphase boundaries of copper and TiC with smaller cathode craters.

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楊曉紅 范志康 梁淑華 肖鵬. TiC對CuW觸頭材料組織與性能的影響[J].稀有金屬材料與工程,2007,36(5):817~821.[Yang Xiaohong, Fan Zhikang, Liang Shuhua, Xiao Peng. Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials[J]. Rare Metal Materials and Engineering,2007,36(5):817~821.]
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  • 最后修改日期:2006-05-10
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