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鎢粉化學鍍銅對W／15Cu電子封裝材料性能的影響
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TG146.411

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湖南省科技廳重點科研資助項目


Effects of Chemical Copperplated W Powder on Properties of W/15Cu Composite
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    摘要:

    采用化學鍍銅的方法在鎢粉中加入誘導銅，經壓型，熔滲后制成W／15Cu合金。用掃描電鏡研究了材料的顯微結構，并測出合金樣品的密度、氣密性、熱膨脹系數(shù)等物理性能，通過與傳統(tǒng)工藝制備的W／15Cu合金的顯微組織以及物理性能方面做比較，討論了鎢粉化學鍍銅對W／15Cu合金性能的影響。結果表明，鎢粉化學鍍銅對于提高鎢生坯成形性能、改善鎢銅復合材料的顯微組織結構、提高材料物理性能方面都有很大作用。經過綜合比較，鍍銅含量以2％為宜。

    Abstract:

    Copper was induced into W powder by electroless, The compacts made from chemical copperplated W powder were infiltrated, and W/15 Cu composites were prepared. The microstructures of the composites were investigated by mean of scanning electron microscope Density, hermeticity and coefficient of thermal expansion were measured. After comparing microstructures and physical property of the W/15Cu made by conventional process, the effects of chemical copperplated W powder on properties of W/15Cu were discussed. The results showed that chemical copperplated W powder could improve the compactibility of W compact, the microstructure and the physical properties of W/15Cu composite. It is indicated that when the compact contains 2% copper, the properties of the material are fairly satisfactory.

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吳泓 王志法 姜國圣 崔大田 鄭秋波.鎢粉化學鍍銅對W／15Cu電子封裝材料性能的影響[J].稀有金屬材料與工程,2007,36(3):550~553.[Wu Hong, Wang Zhifa, Jiang Guosheng, Cui Datian, Zheng Qiubo. Effects of Chemical Copperplated W Powder on Properties of W/15Cu Composite[J]. Rare Metal Materials and Engineering,2007,36(3):550~553.]
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  • 最后修改日期:2006-01-21
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