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退火Cu-W薄膜組織結(jié)構(gòu)與殘余應(yīng)力
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TB43

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國家自然科學(xué)基金項（50471035）和國家重點基礎(chǔ)研究發(fā)展計劃（“973”計劃）資助（2004CB619302）


Phase Structure and Residual Stress in Annealed Cu-W Films
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    摘要:

    以不同溫度真空原位退火工藝為手段，促使制備在單晶Si（100）和Al2O3基底上的Cu-W薄膜發(fā)生相變。用X射線衍射（XRD）分析晶體取向，偏振相位移技術(shù)分析薄膜殘余應(yīng)力。結(jié)果表明，隨退火溫度變化，薄膜相變呈現(xiàn)連續(xù)變化，由初始的非晶態(tài)晶化，出現(xiàn)類W的亞穩(wěn)態(tài)固溶體相，以及隨退火溫度的進(jìn)一步增加，發(fā)生Spinodal分解，亞穩(wěn)固溶體完全分解為W和Cu兩相。薄膜發(fā)生相變時產(chǎn)生拉應(yīng)力作用，而在晶粒生長階段，拉應(yīng)力釋放。

    Abstract:

    The phase transition of Copper-tungsten films deposited on Si (100) and Al2O3 substrates took place by means of in situ annealing in vacuum chamber at different temperatures. X-ray diffraction (XRD) and the polarization phase shift technique were employed to characterize the microstructure and residual stress of Cu-W films, respectively. The results indicated that the two successive but distinctive stages of phase transition appeared with the change of annealing temperatures, i.e., W (Cu) solution formation and two-phase crystalline (W and Cu) structure formation. The relationship between phase transition and residual stress was investigated, the tensile stress was caused during phase transition, whereas it was released with crystalline growth.

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汪淵 李曉華 宋忠孝 徐可為 尉秀英.退火Cu-W薄膜組織結(jié)構(gòu)與殘余應(yīng)力[J].稀有金屬材料與工程,2007,36(3):435~439.[Wang Yuan, Li Xiaohua, Song Zhongxiao, Xu Kewei, Wei Xiuying. Phase Structure and Residual Stress in Annealed Cu-W Films[J]. Rare Metal Materials and Engineering,2007,36(3):435~439.]
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  • 最后修改日期:2006-01-31
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