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納米Cu陰極斑點(diǎn)短程有向運(yùn)動(dòng)分析
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TG146.4 TG174.21

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國家自然科學(xué)基金資助（50471033）


Analysis of the Sub-Directed Walking of Cathode Spots on the Surface of Nanocrystalline Copper
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    摘要:

    采用掃描電子顯微鏡（SEM）觀察了納米Cu陰極在峰值電流為10A的小擊穿電流下首擊穿后的陰極表面燒蝕形貌，發(fā)現(xiàn)納米Cu的陰極斑點(diǎn)從產(chǎn)生到熄滅期間的運(yùn)動(dòng)（即短程運(yùn)動(dòng)）并不是隨機(jī)的，而是有一定取向的；進(jìn)一步通過和常規(guī)Cu首擊穿燒蝕形貌對(duì)比，分析了產(chǎn)生有向運(yùn)動(dòng)的原因。結(jié)果表明：納米Cu陰極斑點(diǎn)的短程有向運(yùn)動(dòng)有利于電弧分散，細(xì)化晶粒是減輕燒蝕的一種途徑。

    Abstract:

    By using a Scanning Electron Microscope (SEM), the tracks of cathode spots on the surface of nanocrystalline Cu cathode produced after the first discharge with peak current of 10 A was investigated. It is found that the movement of cathode spots is sub-directed rather than random. The reason is explained in comparison with conventional Cu. It is suggested that sub-directed walking of cathode spots on the surface of nanocrystalline Cu is beneficial to the diffusion of cathode spots which is responsible for cathode erosion.

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蘇亞鳳 楊志懋 丁秉鈞.納米Cu陰極斑點(diǎn)短程有向運(yùn)動(dòng)分析[J].稀有金屬材料與工程,2007,36(1):68~70.[Su Yafeng, Yang Zhimao, Ding Bingjun. Analysis of the Sub-Directed Walking of Cathode Spots on the Surface of Nanocrystalline Copper[J]. Rare Metal Materials and Engineering,2007,36(1):68~70.]
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  • 最后修改日期:2006-06-08
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