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AuSn釬料及鍍層界面金屬間化合物的演變
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TG146.4

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國家自然科學(xué)基金資助項(xiàng)目（50475031）


Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer
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    摘要:

    對激光軟釬焊下AuSn釬料與Au和Au/Ni金屬化鍍層界面形成的金屬間化合物進(jìn)行SEM及EDX分析,并討論激光輸入能量對界面金屬間化合物演變規(guī)律的影響.研究結(jié)果表明：在激光加熱及快速冷卻條件下,Au迅速溶解到界面附近的釬料中,使得成分偏離共晶點(diǎn),界面處生成穩(wěn)定的Au5Sn;隨著激光功率及加熱時(shí)間的增加,未完全溶解的Au層變薄,Au5Sn向釬料內(nèi)部長大.

    Abstract:

    This paper investigates the intermetallic compound on the interface between AuSn solder and Au or Au/Ni metallization layer after laser soldering by SEM and EDX analysis. The effects of laser power and heating time on the evolution of intermetallic compounds on the interface are discussed. The results show that the components of Jntermetallic compound depart from the eutectic arrest due to Au dissolving quickly into the solder near the interface and forming a stable AusSn at the interface on the condition of laser heating and cooling quickly. With the increase of laser power and heating time, the undissolved Au layer becomes thinner and the AusSn grows into the solder.

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張威 王春青 閻勃晗. AuSn釬料及鍍層界面金屬間化合物的演變[J].稀有金屬材料與工程,2006,35(7):1143~1145.[Zhang Wei, Wang Chunqing, Yan Bohan. Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer[J]. Rare Metal Materials and Engineering,2006,35(7):1143~1145.]
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  • 收稿日期:2005-05-10
  • 最后修改日期:2005-08-10
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