It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating plating. The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless electroless Ultraviolet-visible absorption spectrometry, nanophox, and stereoscopic microscopy were used to characterize the colloids. The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. In order to enhance the dispersivity and minimize the particle size, vanillin was added to colloids solution in the present investigation.
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王桂香 李寧 黎德育.直接電鍍用膠體鈀催化劑的研制及性能[J].稀有金屬材料與工程,2006,35(10):1656~1660.[Wang Guixiang, Li Ning, Li Deyu. Preparation and Properties of Pd Colloids Catalyst for Direct Copper Plating[J]. Rare Metal Materials and Engineering,2006,35(10):1656~1660.] DOI：[doi]