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CuO添加劑對(duì)Ag／SnO2潤(rùn)濕性與界面特性的影響
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TM201.4

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國(guó)家高技術(shù)研究發(fā)展計(jì)劃(863計(jì)劃)(2001從320714)和國(guó)家自然科學(xué)基金資助項(xiàng)目(50071043)


Effect of CuO Additive on the Wettability and Interface Behavior of Silver/Tin Oxide
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    摘要:

    采用座滴法研究了CuO對(duì)Ag/SnO2間潤(rùn)濕角的影響,利用掃描電鏡(SEM)和電子探針顯微分析(EPMA)測(cè)試了試樣界面微觀形貌及過渡區(qū)成分變化.結(jié)果表明,隨著CuO含量的增加,SnO2與Ag的潤(rùn)濕性提高,7%CuO的加入,使Ag/SnO2的潤(rùn)濕角從90°減小到29°.加入CuO后,液態(tài)銀滲入氧化物顆粒間隙,同時(shí)發(fā)生氧化物向銀區(qū)的擴(kuò)散,形成牢固的潤(rùn)濕界面.

    Abstract:

    The contact angles of Ag on SnO2 with different CuO content were measured by the sessile drop method, and the morphology and composition of transition zone of the interfaces were analyzed by SEM and EPMA technique. The results show that the wettability of Ag on SnO2 is improved by increasing the CuO content. The contact angle of Ag/SnO2 decreases from 90oto 29o with 7% CuO content. When CuO dopant is added into SnO2, Ag liquid can infiltrate into MeO, and a little MeO diffuses into Ag zone. So the strong interfacial bonding is obtained.

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王家真 王亞平 楊志懋 王偉 丁秉鈞. CuO添加劑對(duì)Ag／SnO2潤(rùn)濕性與界面特性的影響[J].稀有金屬材料與工程,2005,34(3):405~408.[Wang Jiazhen, Wang Yaping, Yang Zhimao, Wang Wei, Ding Bingjun. Effect of CuO Additive on the Wettability and Interface Behavior of Silver/Tin Oxide[J]. Rare Metal Materials and Engineering,2005,34(3):405~408.]
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  • 最后修改日期:2003-04-25
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