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陶瓷基板化學(xué)鍍銅預(yù)處理的研究
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TQ153.14

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Research of Electroplating Cu on Pretreatment Ceramic Substrates
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    摘要:

    為提高封裝基板銅導(dǎo)體層與陶瓷基板的結(jié)合強度，研究了在氧化鋁和氮化鋁的基板上進行化學(xué)鍍銅，對表面進行粗化和改性，經(jīng)過優(yōu)化工藝條件后，氧化鋁與鍍層的結(jié)合強度可以達到27MPa，氮化鋁與鍍層的結(jié)合強度可以達到22MPa。

    Abstract:

    Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods of adhesion are also studied.

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寧洪龍 耿志挺 馬莒生 黃福祥 錢志勇 陳國海.陶瓷基板化學(xué)鍍銅預(yù)處理的研究[J].稀有金屬材料與工程,2004,33(3):321~323.[Ning Honglong, Geng Zhiting, Ma Jusheng, Huang Fuxiang, Qian Zhiyong, Chen Guohai. Research of Electroplating Cu on Pretreatment Ceramic Substrates[J]. Rare Metal Materials and Engineering,2004,33(3):321~323.]
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  • 最后修改日期:2002-08-01
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