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熱處理對兩種銅膜結合強度的影響
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Effect of Heat Treatment on the Peel Strength of Two Kinds of Cu Film
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    摘要:

    采用PVD和CVD技術制備Cu/TiN/PI試樣，研究表明，TiN薄膜可以有效地阻擋Cu向PI基板內(nèi)部擴散，CVD工藝制備的Cu膜內(nèi)部殘余應力很小，Cu膜有相對高的結合強度；而PVD制備的Cu膜，在有TiN阻擋層存在的情況下，Cu膜內(nèi)存在拉應力，拉應力降低了Cu膜結合強度，300℃退火可以消除膜內(nèi)殘余應力，結合強度提高。

    Abstract:

    Copper-polyimide specimens were presented by chemical vapor deposition (CVD) and physical vapor deposition (PVD) methods, and TiN thin films were deposited by PVD as a diffusion barrier. TiN barriers have shown to be very effective against copper diffusion. The effect of annealing treatment on the adhesion characteristics of copper films were studied. CVD copper films showed small residual stress and high adhesion strength, but for PVD copper film, much residual stress left in copper film when TiN barrier was used. The adhesion improvement by annealing treatment was attributed to the removal of tensile residual stress in copper films in Cu/TiN/PI.

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梁彤祥 劉楊秋 張世驥.熱處理對兩種銅膜結合強度的影響[J].稀有金屬材料與工程,2004,33(12):1341~1343.[Liang Tongxiang, Liu Yangqiu, Zhang Shiji. Effect of Heat Treatment on the Peel Strength of Two Kinds of Cu Film[J]. Rare Metal Materials and Engineering,2004,33(12):1341~1343.]
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  • 最后修改日期:2003-04-14
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